Uyilo oluxhunywayo luququzelela kakhulu ukugcinwa komsebenzisi, luthintela iingxaki ezahlukeneyo kunye neendleko eziphezulu zexesha elibangelwa kukugcinwa kokubuyisela kwifektri, kwaye luququzelele ulawulo lwamandla olumanyeneyo ngegalelo le-DC, elinokulawulwa kude nge-RS232 serial port.
Ubude bobude: 976/915/808nm
Amandla emveliso: Ukuya kuthi ga kwi-50W
I-Fiber core diameter: 200μm
Umzi obonayo wamanani wokuvula amanani: 0.22 NA
Welding yeplastiki
Uphando lwezenzululwazi
I-Laser Soldering
Iinkcukacha(25℃) | Iyunithi | MS-A50 | MS-B50 | MI-S-C30 | |
Idatha ye-Optical(1) | CW Imveliso Amandla | W | 50 | 50 | 30 |
Ubude obuphakathi | nm | 976±10 | 915±10 | 808±10 | |
Ububanzi beSpectral (FWHM) | nm | <6 | |||
Ukutshintsha kwamaza kunye nobushushu | nm/°C | 0.3 | |||
Ukungazinzi kwamandla emveliso(25℃) | % | ±3(iiyure ezi-5) | |||
Uluhlu lwamandla | % | 10-100 | |||
Idatha yeFayibha(1) | Idayamitha engundoqo | µm | 200/400 | ||
Umngxuma wamanani | - | 0.22 | |||
Ifayibha eziqhagayo | m | 5 m/10 m, 3 mm isikrweqe, SMA905 iintloko zamadoda kuzo zombini iziphelo | |||
Ukupheliswa kweFayibha | - | SMA905 ibhinqa | |||
UmbaneDuya | Ukunikezwa Amandla | V | I-DC 24V | ||
Iuput yangoku | A | <7A | |||
Ukutya umbane | W | <150 | |||
Imowudi yokuqhuba | - | Yangoku rhoqo | |||
Imo yokukhupha | - | I-CW okanye iModyuli ye-1 Hz ukuya kwi-20kHz, | |||
Imo yokulawula | - | RS232, I/O | |||
Ukumodareyitha rhoqo | Hz | 1~20K (DC>0.01%) | |||
UkuModulation Pulse Width | - | 20µs -950ms (Pulse)/20µs-999ms (I-Pulse enye) | |||
UkuModulation Ukunyuka/Ixesha Lokuwa (Ubuncinci Ixabiso) | µs | ≤10 | |||
IjoliseBem Idatha(2) | Ubude obuphakathi | nm | 635±10nm | ||
CW Imveliso Amandla | mW | 2 | |||
IiParameters zoomatshini | Imilinganiselo (L×W×H)(3) | mm | 242*156*120 | ||
Ubunzima | kg | <5 | |||
Abanye | Indlela yokupholisa | - | Ukupholisa umoya | ||
Ubushushu bokugcina(4) | ℃ | 5~50 | |||
Ubushushu be-Ambient kwi-Operation(4) | ℃ | 15-30 | |||
Ukupholisa imfuneko | - | Ukupholisa umoya | |||
Ubuntu bezizalwane | % | 5~80 | |||
Iklasi yokhuseleko | - | 4(EN 60825-01) |
(1)Bonana ne-BWT ngezinye iindlela ezikhoyo.
(2) Umqadi ojoliswe kuyo unokwenziwa ngokwezifiso ngokweemfuno zabathengi.
(3)Imilinganiselo yoomatshini ixhomekeke kumandla welaser kunye nemo yokupholisa.
(4)Imeko-bume engaguqukiyo iyafuneka ekusebenzeni nasekugcinweni
♦ Gwema ukuvezwa kwamehlo kunye nolusu kwimitha ethe ngqo ngexesha lokusebenza.
♦ Qinisekisa ukuba isiphelo sefiber output sicocwa ngokufanelekileyo phambi kokusebenza kwelaser.Landela iiprothokholi zokhuseleko ukunqanda ukwenzakala xa uphatha kwaye usika ifayibha.
♦ I-laser diode kufuneka isetyenziswe ngokweenkcukacha.
♦ Ubushushu be-Ambient kwi-Operation ranges ukusuka kwi-15℃ ukuya kwi-30℃.
♦ Ubushushu bokugcina buvela kwi-5℃ ukuya kwi-50℃.